Using IESVE for Thermal Bridging & Parametric Simulation

This session will cover IESVE’s thermal bridging capability, enabling higher-fidelity modelling using Psi and Chi values, alongside Y-value and composite layer methods. It will also cover the Parametric Simulation feature within IESVE, which can be used to investigate a range of design permutations including climate, geometry, renewables, envelope, internal gains & HVAC. 

Please note: This session has taken place. For other training opportunities, please check our website.